Cenergy International
https://cdn.haleymarketing.com/templates/62343/logos/sm-logo-200x200.png
http://www.cenergyintl.com
http://www.cenergyintl.com
USD
27.00
37.00
HOUR
true
Roles and Responsibilities:
Performs fabrication or modification tasks on RF Microwave hybrid microcircuits and sub-assemblies. Duties include performing gold wire bonding using manual and automated 0.001" and 0.0007" machines and ribbon bonding to duroid and ceramic substrates, capacitors, resistors, diodes, spirals and other microelectronic components. This position requires wirebonding onto small pad sizes down to 0.001" in assemblies with very high semiconductor chip density and unusual substrate configurations which require special setup and bonding techniques.
This position will require the capability to troubleshoot defective hybrids circuit card assemblies by visually screening wirebonds or chip placement. Duties will also include installation of substrates and components in highly complex microwave assemblies using paste and sheet epoxies. It also requires the utilization of measurement equipment (e.G. Reticle, drop indicator, bond puller) to check parameters during and after work completion to assure that the unit conforms to specifications. Plans work sequence by assessing work in progress to schedule requirements. The position will also require collaboration with Manufacturing and Quality Engineering on procedures and troubleshooting methodologies.
Qualifications and Education Requirements:
Basic Required Qualifications:
Experience in wirebonding and ribbon bonding (0.001" and 0.0007" wire and various sizes of ribbon)
Ability to work 10 hours under a microscope and utilize hand tools such as torque drivers, tweezers and other similar tools
Good dexterity and eye/hand coordination
Experience in microelectronics assembly (chip and wire assembly)
Ability to read and work from detailed work instructions and drawings; computer skills are required to support retrieval of drawings and work instructions as well as other job activities
Ability to work in a diverse team environment; Good interpersonal, teaming and communication skills
High School Diploma required
Second Shift Hours 3: 00pm to 1: 30am
Desired Skills:
Experience in hybrid assembly in accordance with Mil STD 883
Experience wirebonding or ribbon bonding to ceramic or duroid substrates
Experience using Westbond and Metcal bonding machines and Unitech welder.
Experience in substrate and component attach, auto pick-and-place
Experience operating auto or manual bonding equipment
Familiarity working in an ESD and FOD controlled environment
Experience in mechanical assembly processes of small electronic devices
Experience working on military products in ISO 9001 / AS9100 controlled environments
#CJ Secret
Preferred Skills:
For more information, please email us at recruiters@cenergyintl.Com
Pay Range:
The pay range for this position is $27.00-37.00 per hour; however, the pay offered may vary depending on job-related knowledge, skills, and experience. This pay information is being provided pursuant to applicable law and is based in part on market location.
Please Note:
Must have a valid driver s license and current state required minimum vehicle insurance coverage to drive onto Client and Company property.
Benefits:
The benefits available with this position include:
Cenergy is a dynamic, diverse, woman-owned company that has provided stellar support to our clients globally for over 25 years! We hire extraordinary people, and each of our team members are encouraged to embody our core values to drive innovation and own it with integrity and trust while adding to our positive and forward-thinking atmosphere.
Assembler
Posted: 04/19/2024
2024-04-19
2024-07-28
Job Category: Machine Operator
Job Number: 180007
Pay Rate: $27.00 - $37.00
Job Description
Roles and Responsibilities:
Performs fabrication or modification tasks on RF Microwave hybrid microcircuits and sub-assemblies. Duties include performing gold wire bonding using manual and automated 0.001" and 0.0007" machines and ribbon bonding to duroid and ceramic substrates, capacitors, resistors, diodes, spirals and other microelectronic components. This position requires wirebonding onto small pad sizes down to 0.001" in assemblies with very high semiconductor chip density and unusual substrate configurations which require special setup and bonding techniques.
This position will require the capability to troubleshoot defective hybrids circuit card assemblies by visually screening wirebonds or chip placement. Duties will also include installation of substrates and components in highly complex microwave assemblies using paste and sheet epoxies. It also requires the utilization of measurement equipment (e.G. Reticle, drop indicator, bond puller) to check parameters during and after work completion to assure that the unit conforms to specifications. Plans work sequence by assessing work in progress to schedule requirements. The position will also require collaboration with Manufacturing and Quality Engineering on procedures and troubleshooting methodologies.
Qualifications and Education Requirements:
Basic Required Qualifications:
Experience in wirebonding and ribbon bonding (0.001" and 0.0007" wire and various sizes of ribbon)
Ability to work 10 hours under a microscope and utilize hand tools such as torque drivers, tweezers and other similar tools
Good dexterity and eye/hand coordination
Experience in microelectronics assembly (chip and wire assembly)
Ability to read and work from detailed work instructions and drawings; computer skills are required to support retrieval of drawings and work instructions as well as other job activities
Ability to work in a diverse team environment; Good interpersonal, teaming and communication skills
High School Diploma required
Second Shift Hours 3: 00pm to 1: 30am
Desired Skills:
Experience in hybrid assembly in accordance with Mil STD 883
Experience wirebonding or ribbon bonding to ceramic or duroid substrates
Experience using Westbond and Metcal bonding machines and Unitech welder.
Experience in substrate and component attach, auto pick-and-place
Experience operating auto or manual bonding equipment
Familiarity working in an ESD and FOD controlled environment
Experience in mechanical assembly processes of small electronic devices
Experience working on military products in ISO 9001 / AS9100 controlled environments
#CJ Secret
Preferred Skills:
For more information, please email us at recruiters@cenergyintl.Com
Pay Range:
The pay range for this position is $27.00-37.00 per hour; however, the pay offered may vary depending on job-related knowledge, skills, and experience. This pay information is being provided pursuant to applicable law and is based in part on market location.
Please Note:
Must have a valid driver s license and current state required minimum vehicle insurance coverage to drive onto Client and Company property.
Benefits:
The benefits available with this position include:
- Ongoing Training (RSO, Systems, Software Programs, OSHA Safety, JJ Keller, etc.)
- Continuous Employment Development and Learning
- Ongoing Advocacy, internal assets with HSE, Legal and HR teams and experts to aid in Employee Career Path and Advancement
- 401K
- Aetna Group Medical Coverage & Kaiser for California only
- Dental Insurance Coverage
- Vision Insurance Coverage
- Basic Life Insurance & AD&D
- Long Term Disability
- Voluntary Short-Term Disability
- Direct Deposit
- Health Savings and Flexible Spending Accounts
Cenergy is a dynamic, diverse, woman-owned company that has provided stellar support to our clients globally for over 25 years! We hire extraordinary people, and each of our team members are encouraged to embody our core values to drive innovation and own it with integrity and trust while adding to our positive and forward-thinking atmosphere.
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